Issued Patents All Time
Showing 26–50 of 104 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10249580 | Stacked substrate inductor | Daeik Daniel Kim, Changhan Hobie Yun, David Francis Berdy, Chengjie Zuo, Jonghae Kim | 2019-04-02 |
| 10242957 | Compartment shielding in flip-chip (FC) module | Daeik Daniel Kim, Changhan Hobie Yun, David Francis Berdy, Chengjie Zuo, Jonghae Kim +1 more | 2019-03-26 |
| 10187031 | Tunable matching network | Yunfei Ma, Chengjie Zuo, David Francis Berdy, Daeik Daniel Kim, Changhan Hobie Yun +4 more | 2019-01-22 |
| 10171112 | RF multiplexer with integrated directional couplers | Yunfei Ma, Chengjie Zuo, David Francis Berdy, Daeik Daniel Kim, Changhan Hobie Yun +4 more | 2019-01-01 |
| 10163771 | Interposer device including at least one transistor and at least one through-substrate via | Chengjie Zuo, Changhan Hobie Yun, David Francis Berdy, Niranjan Sunil Mudakatte, Shiqun Gu +1 more | 2018-12-25 |
| 10154591 | Passive device assembly for accurate ground plane control | Chengjie Zuo, David Francis Berdy, Daeik Daniel Kim, Changhan Hobie Yun, Jonghae Kim | 2018-12-11 |
| 10141908 | Multi-density MIM capacitor for improved passive on glass (POG) multiplexer performance | Niranjan Sunil Mudakatte, David Francis Berdy, Changhan Hobie Yun, Chengjie Zuo, Shiqun Gu +1 more | 2018-11-27 |
| 10141353 | Passive components implemented on a plurality of stacked insulators | Changhan Hobie Yun, Daeik Daniel Kim, Jonghae Kim, Chengjie Zuo, David Francis Berdy | 2018-11-27 |
| 10116285 | Integration of a replica circuit and a transformer above a dielectric substrate | Je-Hsiung Lan, Chi Shun Lo, Jonghae Kim, John H. Hong | 2018-10-30 |
| 10115671 | Incorporation of passives and fine pitch through via for package on package | Ravindra V. Shenoy, Kwan-Yu Lai, Philip Jason Stephanou, Jonghae Kim, Evgeni Gousev | 2018-10-30 |
| 10103703 | Double-sided circuit | Changhan Hobie Yun, David Francis Berdy, Chengjie Zuo, Daeik Daniel Kim, Jonghae Kim +2 more | 2018-10-16 |
| 10103135 | Backside ground plane for integrated circuit | Chengjie Zuo, Jonghae Kim, David Francis Berdy, Changhan Hobie Yun, Niranjan Sunil Mudakatte +1 more | 2018-10-16 |
| 10103116 | Open-passivation ball grid array pads | Daeik Daniel Kim, Changhan Hobie Yun, Chengjie Zuo, David Francis Berdy, Jonghae Kim +1 more | 2018-10-16 |
| 10074625 | Wafer level package (WLP) ball support using cavity structure | David Francis Berdy, Changhan Hobie Yun, Jonghae Kim, Chengjie Zuo, Daeik Daniel Kim +3 more | 2018-09-11 |
| 10069474 | Encapsulation of acoustic resonator devices | Changhan Hobie Yun, Chengjie Zuo, Daeik Daniel Kim, Niranjan Sunil Mudakatte, Je-Hsiung Lan +4 more | 2018-09-04 |
| 10049815 | Nested through glass via transformer | Daeik Daniel Kim, Jonghae Kim, Chengjie Zuo, Changhan Hobie Yun | 2018-08-14 |
| 10044390 | Glass substrate including passive-on-glass device and semiconductor die | Changhan Hobie Yun, Chengjie Zuo, Niranjan Sunil Mudakatte, Shiqun Gu, Jonghae Kim +1 more | 2018-08-07 |
| 10039188 | Two-stage power delivery architecture | Changhan Hobie Yun, Francesco Carobolante, Chengjie Zuo, Jonghae Kim, Lawrence D. Smith +1 more | 2018-07-31 |
| 10038422 | Single-chip multi-frequency film bulk acoustic-wave resonators | Changhan Hobie Yun, Je-Hsiung Lan, Chengjie Zuo, David Francis Berdy, Jonghae Kim +2 more | 2018-07-31 |
| 10026546 | Apparatus with 3D wirewound inductor integrated within a substrate | Changhan Hobie Yun, Chengjie Zuo, Daeik Daniel Kim, Niranjan Sunil Mudakatte, Jonghae Kim +1 more | 2018-07-17 |
| 9966426 | Augmented capacitor structure for high quality (Q)-factor radio frequency (RF) applications | Niranjan Sunil Mudakatte, Daeik Daniel Kim, David Francis Berdy, Changhan Hobie Yun, Je-Hsiung Lan +3 more | 2018-05-08 |
| 9959964 | Thin film magnet inductor structure for high quality (Q)-factor radio frequency (RF) applications | Changhan Hobie Yun, David Francis Berdy, Daeik Daniel Kim, Chengjie Zuo, Jonghae Kim +2 more | 2018-05-01 |
| 9954267 | Multiplexer design using a 2D passive on glass filter integrated with a 3D through glass via filter | Changhan Hobie Yun, Daeik Daniel Kim, Chengjie Zuo, David Francis Berdy, Jonghae Kim | 2018-04-24 |
| 9935166 | Capacitor with a dielectric between a via and a plate of the capacitor | Je-Hsiung Lan, Chengjie Zuo, Changhan Hobie Yun, David Francis Berdy, Daeik Daniel Kim +2 more | 2018-04-03 |
| 9930783 | Passive device assembly for accurate ground plane control | Chengjie Zuo, David Francis Berdy, Daeik Daniel Kim, Changhan Hobie Yun, Jonghae Kim | 2018-03-27 |