Issued Patents All Time
Showing 101–104 of 104 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8847375 | Microelectromechanical systems embedded in a substrate | Milind Shah, Fifin Sweeney | 2014-09-30 |
| 8633597 | Thermal vias in an integrated circuit package with an embedded die | Fifin Sweeney, Milind Shah, Damion B. Gastelum | 2014-01-21 |
| 7602050 | Integrated circuit packaging | Laxminarayan Sharma | 2009-10-13 |
| 5454270 | Hermetically sealed pressure sensor and method thereof | Clem H. Brown, Daniel J. Wallace | 1995-10-03 |