Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10224264 | High performance evaporation-condensation thermal spreading chamber for compute packages | Ali Akbar Merrikh, Mehdi Saeidi, Guoping Xu, Luis Eduardo De Los Heros Beunza, Ajay Vadakkepatt +1 more | 2019-03-05 |
| 9171782 | Stacked redistribution layers on die | Christine Hau-Riege, You-Wen Yau, Kevin Patrick Caffey, Lizabeth Keser, Gene H. McAllister +2 more | 2015-10-27 |
| 8633597 | Thermal vias in an integrated circuit package with an embedded die | Fifin Sweeney, Milind Shah, Mario Francisco Velez | 2014-01-21 |
| 8601428 | System and method for use case-based thermal analysis of heuristically determined component combinations and layouts in a portable computing device | James D. Burrell, Zhongping Bao, Liang Cheng, Gary D. Good, Mohammed Tantoush +1 more | 2013-12-03 |
| D589461 | Remote control device | Neil Burns, Srinivas Raghavan, John Cunningham | 2009-03-31 |
| D588554 | Remote control device | Neil Burns, Srinivas Raghavan, John Cunningham | 2009-03-17 |
| D571306 | Remote control device | Neil Burns, Srinivas Raghavan, John Cunningham | 2008-06-17 |
| D571307 | Remote control device | Neil Burns, Srinivas Raghavan, John Cunningham | 2008-06-17 |
| D571308 | Remote control device | Neil Burns, Srinivas Raghavan, John Cunningham | 2008-06-17 |