Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 9184144 | Interconnect pillars with directed compliance geometry | Zhongping Bao, Shiqun Gu | 2015-11-10 | $6,275,000 |
| 8937384 | Thermal management of integrated circuits using phase change material and heat spreaders | Zhongping Bao, Liang Cheng | 2015-01-20 | $16,812,000 |
| 8601428 | System and method for use case-based thermal analysis of heuristically determined component combinations and layouts in a portable computing device | Zhongping Bao, Liang Cheng, Damion B. Gastelum, Gary D. Good, Mohammed Tantoush +1 more | 2013-12-03 | $8,275,000 |