Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Interconnect pillars with directed compliance geometry

Interconnect pillars with directed compliance geometry

US Patent 9184144 · Granted Nov 10, 2015

Estimated economic value: $6,275,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Multi-tier IC package including processor and high bandwidth memory2024
Chipset and manufacturing method thereof2024
Complementary ring oscillators to monitor in-situ stress within integrated circu2023
Merged power pad for improving integrated circuit power delivery2023
IC die to IC die interconnect using error correcting code and data path interlea2023
Merged power pad for improving integrated circuit power delivery2022
Wrapped signal shielding in a wafer fanout package2021
Bottom package with metal post interconnections2021
Hybrid passive-on-glass (POG) acoustic filter2021
Integrated circuits (ICs) on a glass substrate2021
Semiconductor package having reduced internal power pad pitch2020
Heterogenous 3D chip stack for a mobile processor2020