Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10490489 | Conductive clip connection arrangements for semiconductor packages | Stuart B. Molin | 2019-11-26 |
| 10128170 | Conductive clip connection arrangements for semiconductor packages | Stuart B. Molin | 2018-11-13 |
| 9159694 | Die stacking system and method | Henry Laurel Sanchez | 2015-10-13 |
| 7872356 | Die stacking system and method | Hen Sanchez | 2011-01-18 |
| 7602050 | Integrated circuit packaging | Mario Francisco Velez | 2009-10-13 |
| 6574861 | System and method for solder ball rework | Hong Yang | 2003-06-10 |
| 6566761 | Electronic device package with high speed signal interconnect between die pad and external substrate pad | Siamak Fazelpour | 2003-05-20 |
| 5990547 | Semiconductor device having plated contacts and method thereof | Burton J. Carpenter | 1999-11-23 |
| 5962926 | Semiconductor device having multiple overlapping rows of bond pads with conductive interconnects and method of pad placement | Victor Manuel Torres, Ashok Srikantappa | 1999-10-05 |
| 5898213 | Semiconductor package bond post configuration | Victor Manuel Torres, Ashok Srikantappa | 1999-04-27 |