Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5962926 | Semiconductor device having multiple overlapping rows of bond pads with conductive interconnects and method of pad placement | Ashok Srikantappa, Laxminarayan Sharma | 1999-10-05 |
| 5932924 | Leadframe having continuously reducing width and semiconductor device including such a leadframe | Joseph B. Diana | 1999-08-03 |
| 5898213 | Semiconductor package bond post configuration | Laxminarayan Sharma, Ashok Srikantappa | 1999-04-27 |