Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Systems and methods for reducing backside deposition and mitigating thickness changes at substrate edges

Systems and methods for reducing backside deposition and mitigating thickness changes at substrate edges

US Patent 9460915 · Granted Oct 4, 2016

Estimated economic value: $28,565,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Plasma enhanced atomic layer deposition of silicon-containing films2025
Semiconductor processing device2025
Dynamic precursor dosing for atomic layer deposition2025
Modulated atomic layer deposition2025
Multi-station semiconductor processing with independently adjustable pedestals2025
Multi-station semiconductor processing with independently adjustable pedestals2025
Impurity reduction in silicon-containing films2025
Ultrathin atomic layer deposition film accuracy thickness control2025
Vapor deposition of films comprising molybdenum2025
Mechanical suppression of parasitic plasma in substrate processing chamber2025
Rapid tuning of critical dimension non-uniformity by modulating temperature tran2025
Throughput improvement with interval conditioning purging2025