Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Integrated circuit device having extended under ball metallization

Integrated circuit device having extended under ball metallization

US Patent 8575493 · Granted Nov 5, 2013

Estimated economic value: $7,192,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Power semiconductor apparatus and bonding method thereof2025
Electrostatic comb drive-based silicon-based MEMS optical switch and N × N array2025
Ultra-broadband silicon waveguide micro-electro-mechanical systems (MEMS) photon2023
System for monitoring and controlling an integrated circuit testing machine2022
Optical sensor packaging system2022
Thinned semiconductor chip with edge support2022
Wafer-level chip-scale package device having bump assemblies configured to maint2020
Optical sensor packaging system2020
Optical sensor packages employing cloaking layers2019
MEMS-based wafer level packaging for thermo-electric IR detectors2019
Wafer level package device formed using a wafer level lead frame on a carrier wa2019
High-resolution electric field sensor in cover glass2019