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Home › Wafer level package device formed using a wafer level lead frame on a carrier wafer having a similar coefficient of thermal expansion as an active wafer

Wafer level package device formed using a wafer level lead frame on a carrier wafer having a similar coefficient of thermal expansion as an active wafer

US Patent 10304758 · Granted May 28, 2019

Estimated economic value: $39,365,000 ⓘ

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