Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor package with under bump metallization aligned with open vias

Semiconductor package with under bump metallization aligned with open vias

US Patent 8030768 · Granted Oct 4, 2011

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor device packaging warpage control2024
Tie bar removal for semiconductor device packaging2024
Semiconductor packages with integrated shielding2024
Semiconductor device packaging warpage control2023
Semiconductor device packaging warpage control2023
Semiconductor device having integrated antenna and method therefor2023
Semiconductor device packaging warpage control2022
Stacked dies electrically connected to a package substrate by lead terminals2022
Tie bar removal for semiconductor device packaging2022
Semiconductor packages with electromagnetic interference shielding2020
Semiconductor package with a heat spreader and method of manufacturing thereof2020
Multi-layer leadless semiconductor package and method of manufacturing the same2020