Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Tie bar removal for semiconductor device packaging

Tie bar removal for semiconductor device packaging

US Patent 11222790 · Granted Jan 11, 2022

Estimated economic value: $32,468,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method for target detection based on correlation analysis of spatial phase in an2025
Semiconductor device package having thermal dissipation feature and method there2025
Semiconductor device package having thermal dissipation feature and method there2025
Semiconductor device with cavity carrier and method therefor2025
Semiconductor device having galvanic isolation and method therefor2025
Mowing cylinder cutter and lawn care tool driven by built-in outer rotor motor2025
Surface-mount amplifier devices2024
Semiconductor device packaging warpage control2024
Semiconductor device packaging warpage control2024
Radio frequency packages containing multilevel power substrates and associated f2024
Radio frequency packages containing multilevel power substrates and associated f2024
Tie bar removal for semiconductor device packaging2024