{"@context": "https://schema.org", "@type": "BreadcrumbList", "itemListElement": [{"@type": "ListItem", "position": 1, "name": "Home", "item": "https://www.patentleaderboard.com/"}, {"@type": "ListItem", "position": 2, "name": "Optical die structures and associated package substrates", "item": "https://www.patentleaderboard.com/patent/7831115"}]}
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Home › Optical die structures and associated package substrates

Optical die structures and associated package substrates

US Patent 7831115 · Granted Nov 9, 2010

Estimated economic value: $16,505,000 ⓘ

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