Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Reliable low-k interconnect structure with hybrid dielectric

Reliable low-k interconnect structure with hybrid dielectric

US Patent 7135398 · Granted Nov 14, 2006

Estimated economic value: $5,090,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Anti-fuse and fuse structures for improving the functionality of qubit circuits2025
Magnetoresistive random-access memory (MRAM) with preserved underlying dielectri2025
Anti-fuse and fuse structures for improving the functionality of qubit circuits2025
Device mismatch mitigation for medium range and beyond distances2025
Method for making printed wiring board, printed wiring board, and adhesive film 2024
Layered substrate structures with aligned optical access to electrical devices2024
Rework for metal interconnects using etch and thermal anneal2024
Contacts having a geometry to reduce resistance2024
Interconnect structures including self aligned vias2023
Latch-up avoidance for sea-of-gates2023
Microwave-to-optical quantum transducers2023
Multiple patterning with mandrel cuts defined by block masks2022