Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Interconnect structures including self aligned vias

Interconnect structures including self aligned vias

US Patent 11735468 · Granted Aug 22, 2023

Estimated economic value: $5,113,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Power distribution network with backside power rail2025
Backside power rail with tight space2025
Semiconductor structure with backside metallization layers2025
Magnetoresistive random-access memory with top and bottom electrodes deposited i2025
Locally widened profile for nanoscale wiring structure2025
Double patterning with selectively deposited spacer2025
MRAM integration with self-aligned direct back side contact2025
MRAM structure with a T-shaped ferromagnetic layer2025
MRAM structure with a T-shaped ferromagnetic layer2025
Back-end-of-line thin film resistor2025
MRAM bottom electrode contact with taper profile2025
Top via interconnect with airgap2025