Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Post CU CMP polishing for reduced defects

Post CU CMP polishing for reduced defects

US Patent 6436302 · Granted Aug 20, 2002

Estimated economic value: $16,370,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Double-sided scrubber for substrate cleaning2025
Magazine and intelligent approval system thereof2025
Method and system for parallel design and technology optimization2025
Roller for location-specific wafer polishing2025
Polishing articles and integrated system and methods for manufacturing chemical 2024
Polishing articles and integrated system and methods for manufacturing chemical 2024
Printing a chemical mechanical polishing pad2024
Techniques for combining CMP process tracking data with 3D printed CMP consumabl2024
Integrated abrasive polishing pads and manufacturing methods2024
Integrated abrasive polishing pads and manufacturing methods2024
Apparatus and method of forming a polishing article that has a desired zeta pote2024
Additive manufacturing of polishing pads2024