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Home › Apparatus for bonding a semiconductor die to a package using a gold/silicon preform and cooling the die and package through a monotonically decreasing temperature sequence

Apparatus for bonding a semiconductor die to a package using a gold/silicon preform and cooling the die and package through a monotonically decreasing temperature sequence

US Patent 5259545 · Granted Nov 9, 1993

Estimated economic value: $3,399,000 ⓘ

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