Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Package structure and method for reducing bond wire inductance

Package structure and method for reducing bond wire inductance

US Patent 5371321 · Granted Dec 6, 1994

Estimated economic value: $1,238,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Polysaccharide carbon nanogels and anticoagulants and antioxidants comprising th2023
Chip package and manufacturing method thereof2020
Chip package and manufacturing method thereof2019
Package structure of a microphone2011
Cap package for micro electro-mechanical system2009
Method of fabricating a BGA package using PCB and tape in a die-up configuration2002
Reinforced sealing technique for an integrated circuit package2001
BGA package using PCB and tape in a die-up configuration2000
Printed circuit board layout to minimize the clock delay caused by mismatch in l2000
Printed circuit board layout to minimize the clock delay caused by mismatch in l2000
BGA package using PCB and tape in a die-down configuration1999
Cavity down HBGA package structure1999