Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Cap package for micro electro-mechanical system

Cap package for micro electro-mechanical system

US Patent 7511373 · Granted Mar 31, 2009

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Polysaccharide carbon nanogels and anticoagulants and antioxidants comprising th2023
Chip packaging method2022
Pressure sensor package2021
Chip package and manufacturing method thereof2020
Waterproof MEMS chip package structure2020
Package structure of long-distance sensor and packaging method of the same2019
MEMS microphone package2019
MEMS microphone package2019
Chip package and manufacturing method thereof2019
Substrate and package module including the same2019
MEMS microphone package2019
Packaging method of long-distance sensor2018