Issued Patents All Time
Showing 25 most recent of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11410856 | Chip packaging method | — | 2022-08-09 |
| 11041774 | Pressure sensor package | Chiung-Yueh TIEN, Cheng-Yao Chang, Mei-Yen Su | 2021-06-22 |
| 10696543 | Waterproof MEMS chip package structure | Chiung-Yueh TIEN | 2020-06-30 |
| 10396234 | Package structure of long-distance sensor and packaging method of the same | Ching-I Lin | 2019-08-27 |
| 10362377 | MEMS microphone package | Hsien-Ken Liao, Jyong-Yue Tian, Yao-Ting YEH | 2019-07-23 |
| 10362406 | MEMS microphone package | Yao-Ting YEH, Hsien-Ken Liao, Jyong-Yue Tian | 2019-07-23 |
| 10312169 | Substrate and package module including the same | Yu-Shiang CHEN, Chao-Wei Yu, Yu-Lin Hsiao | 2019-06-04 |
| 10299046 | MEMS microphone package | Hsien-Ken Liao, Jyong-Yue Tian, Yao-Ting YEH | 2019-05-21 |
| 10103286 | Packaging method of long-distance sensor | Ching-I Lin | 2018-10-16 |
| 10090427 | Package structure of long-distance sensor and packaging method of the same | Ching-I Lin | 2018-10-02 |
| 10003874 | Microphone package structure | Yao-Ting YEH | 2018-06-19 |
| 9952089 | Optical sensing module and method of manufacturing the same | Yu-Chang Huang | 2018-04-24 |
| 9905548 | Optical module integrated package | Yao-Ting YEH, Yu-Chen Lin | 2018-02-27 |
| 9705025 | Package structure of an optical module | Yu-Chen Lin | 2017-07-11 |
| 9647178 | Package structure of optical module having printed shielding layer and its method for packaging | Yao-Ting YEH | 2017-05-09 |
| 9618415 | Pressure sensor package | Chao-Wei Yu, Chih-Ming Liu | 2017-04-11 |
| 9478693 | Optical module package and its packaging method | Yu-Chen Lin | 2016-10-25 |
| 9449955 | Optical module integrated package | Yao-Ting YEH, Yu-Chen Lin | 2016-09-20 |
| 9416930 | LED lamp strip and manufacturing process thereof | Mu-Tsan LIAO | 2016-08-16 |
| 9312402 | Micro optical package structure with filtration layer and method for making the same | Yao-Ting YEH | 2016-04-12 |
| 9309108 | MEMS microphone packaging method | Hsien-Ken Liao | 2016-04-12 |
| 9260298 | Stacked MEMS microphone packaging method | Hsien-Ken Liao | 2016-02-16 |
| 9190398 | Method for packaging an optical module | Yao-Ting YEH | 2015-11-17 |
| 8664045 | LED lamp strip and manufacturing process thereof | Mu-Tsan LIAO | 2014-03-04 |
| 8362496 | Optical module package unit | Chao-Wei Yu | 2013-01-29 |