Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11041774 | Pressure sensor package | Ming-Te Tu, Cheng-Yao Chang, Mei-Yen Su | 2021-06-22 |
| 10696543 | Waterproof MEMS chip package structure | Ming-Te Tu | 2020-06-30 |
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11041774 | Pressure sensor package | Ming-Te Tu, Cheng-Yao Chang, Mei-Yen Su | 2021-06-22 |
| 10696543 | Waterproof MEMS chip package structure | Ming-Te Tu | 2020-06-30 |