Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11805342 | Sound producing package structure and manufacturing method thereof | Chiung C. Lo, Martin Lim | 2023-10-31 |
| 11758312 | Sound producing package structure and manufacturing method thereof | Chiung C. Lo | 2023-09-12 |
| 11252511 | Package structure and methods of manufacturing sound producing chip, forming package structure and forming sound producing apparatus | Chiung C. Lo, David Hong, Jemm Yue Liang, Lei Chen, Hai-Hung Wen +4 more | 2022-02-15 |
| 10362406 | MEMS microphone package | Yao-Ting YEH, Jyong-Yue Tian, Ming-Te Tu | 2019-07-23 |
| 10362377 | MEMS microphone package | Ming-Te Tu, Jyong-Yue Tian, Yao-Ting YEH | 2019-07-23 |
| 10299046 | MEMS microphone package | Ming-Te Tu, Jyong-Yue Tian, Yao-Ting YEH | 2019-05-21 |
| 9309108 | MEMS microphone packaging method | Ming-Te Tu | 2016-04-12 |
| 9260298 | Stacked MEMS microphone packaging method | Ming-Te Tu | 2016-02-16 |