HW

Hai-Hung Wen

XL Xmems Labs: 3 patents #15 of 28Top 55%
AT Altus Technology: 1 patents #7 of 17Top 45%
UM United Microelectronics: 1 patents #2,686 of 4,560Top 60%
📍 Keelung, TW: #116 of 650 inventorsTop 20%
Overall (All Time): #793,130 of 4,157,543Top 20%
6
Patents All Time

Issued Patents All Time

Showing 1–6 of 6 patents

Patent #TitleCo-InventorsDate
12063470 Acoustic package structure and covering structure Chao-Yu Chen, Wen-Chien Chen, Chiung C. Lo 2024-08-13
11917348 Covering structure, sound producing package and related manufacturing method Wei Li 2024-02-27
11395073 Sound producing package structure and method for packaging sound producing package structure Chiung C. Lo, Jemm Yue Liang 2022-07-19
11252511 Package structure and methods of manufacturing sound producing chip, forming package structure and forming sound producing apparatus Chiung C. Lo, David Hong, Jemm Yue Liang, Lei Chen, JengYaw Jiang +4 more 2022-02-15
7639303 Method and apparatus for lens auto-focusing in camera module test Yu-Wen Tai, Chien-I Chen 2009-12-29
6613696 Method of forming composite silicon oxide layer over a semiconductor device Yu-Chih Chuang 2003-09-02