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Home › Printed circuit board layout to minimize the clock delay caused by mismatch in length of metal lines and enhance the thermal performance of microelectronics packages via conduction through the package leads

Printed circuit board layout to minimize the clock delay caused by mismatch in length of metal lines and enhance the thermal performance of microelectronics packages via conduction through the package leads

US Patent 6047467 · Granted Apr 11, 2000

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