Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Integrate rinse module in hybrid bonding platform

Integrate rinse module in hybrid bonding platform

US Patent 12255062 · Granted Mar 18, 2025

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Physical distancing tracking and notification2025
Hard mask layer below via structure in display device2025
Semiconductor device and methods of manufacturing thereof2025
Circuit design and layout with high embedded memory density2025
Method to reduce breakdown failure in a MIM capacitor2025
Deep trench isolation structure and methods for fabrication thereof2025
Ring cover2025
Hot spot defect detecting method and hot spot defect detecting system2025
Thin film transfer using substrate with etch stop layer and diffusion barrier la2025
Photonic semiconductor-on-insulator (SOI) substrate and method for forming the p2025
Resistive memory cell with switching layer comprising one or more dopants2025
Ring cover2025