Circuit board structure and manufacturing method thereof

Assignee

• Unimicron Technology

Inventors

• John Hon-Shing Lau (33 patents)
• Cheng-Ta Ko (55 patents)
• Pu-Ju Lin (37 patents)
• Chi-Hai Kuo (11 patents)
• Kai-Ming Yang (43 patents)
• Chia-Yu Peng (9 patents)
• Shao-Chien Lee (18 patents)
• Tzyy-Jang Tseng (99 patents)

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