Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Barrier-less prefilled via formation

Barrier-less prefilled via formation

US Patent 11152257 · Granted Oct 19, 2021

Estimated economic value: $2,168,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Reduced capacitance between power via bar and gates2025
Reduced capacitance between power via bar and gates2025
Backside self aligned skip via2025
Backside self aligned skip via2025
Double patterned microcooler having alternating fin widths2025
Airgap spacer for power via2025
Airgap spacer for power via2025
Semiconductor passive device integration for silicon-on-insulator substrate2025
Self-forming barrier for use in air gap formation2025
Early backside first power delivery network2025
Early backside first power delivery network2025
Early backside first power delivery network2025