Method for filling recessed features in semiconductor devices with a low-resistivity metal

Assignee

• Tokyo Electron Limited

Inventors

• Kai-Hung Yu (43 patents)
• David L. O'Meara (49 patents)
• Nicholas Joy (15 patents)
• Gyanaranjan Pattanaik (5 patents)
• Robert D. Clark (97 patents)
• Kandabara Tapily (90 patents)
• Takahiro Hakamata (8 patents)
• Cory Wajda (29 patents)
• Gerrit J. Leusink (52 patents)

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