Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Chemical mechanical polishing (CMP) composition for high effective polishing of substrates comprising germanium

Chemical mechanical polishing (CMP) composition for high effective polishing of substrates comprising germanium

US Patent 10227506 · Granted Mar 12, 2019

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Applying machine learning to telematics data to predict accident outcomes2025
Compositions for tungsten etching inhibition2025
Chemical mechanical polishing of substrates containing copper and ruthenium2025
High capacity bilayer cathode for aqueous Zn-ion batteries2025
Holding system for holding substrates during a processing of the surfaces of the2025
Chemical mechanical polishing composition2024
Chemical mechanical polishing composition2024
Chemical mechanical polishing composition2024
Chemical mechanical polishing composition2024
Chemical mechanical polishing of substrates containing copper and ruthenium2023
Polymeric additives for reducing the viscosity loss on tinting2023
Tool fixture for multiple process steps2023