Chemical mechanical polishing of substrates containing copper and ruthenium

Assignee

• Basf Se

Inventors

• Haci Osman GUEVENC (13 patents)
• Michael Lauter (24 patents)
• Te Yu Wei (7 patents)
• Wei-Lan Chiu (10 patents)
• Reza Golzarian (20 patents)
• Julian Proelss (18 patents)
• Leonardus Leunissen (13 patents)

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