Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11401393 | Prepreg, metal-clad laminate, and wiring board | Yuki Kitai, Mikio Sato, Yasunori HOSHINO, Masashi Koda, Hiroaki Fujiwara | 2022-08-02 |
| 11242425 | Resin composition, prepreg, resin-added film, resin-added metal foil, metal-clad layered plate, and wiring plate | Mikio Sato, Hiroaki Fujiwara, Yuki Kitai, Masashi Koda, Yasunori HOSHINO | 2022-02-08 |
| 10751976 | Resin-clad metal foil and flexible printed wiring board | Yohsuke Ishikawa, Yoshiaki Esaki, Jun Tochihira, Ryu Harada | 2020-08-25 |
| 10543661 | Metal foil with resin, and metal-clad laminate and circuit board using same | Akihiro Yamauchi, Yoshiaki Esaki, Hiroaki UMEHARA, Hiroharu Inoue, Yoshihiko Nakamura | 2020-01-28 |
| 9232636 | Flexible printed wiring board and laminate for production of flexible printed wiring board | Yohsuke Ishikawa, Yoshiaki Esaki, Hiroyuki Fukusumi | 2016-01-05 |
| 9125307 | Flexible metal-cladded base material, method for producing flexible metal-cladded base material, printed wiring board, multilayer flexible printed wiring board, and flex-rigid printed wiring board | Hiroaki UMEHARA, Yoshiaki Esaki | 2015-09-01 |