Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176237 | Electrostatic chuck device | Tomoya Hagihara | 2024-12-24 |
| 11818835 | Multilayer printed wiring board, multilayer metal-clad laminated board, and resin-coated metal foil | Hiroaki Takahashi, Kiyotaka Komori, Masaya Koyama, Ryu Harada | 2023-11-14 |
| 10822527 | Thermosetting adhesive composition, thermosetting adhesive film, and composite film | Ryu Harada | 2020-11-03 |
| 10751976 | Resin-clad metal foil and flexible printed wiring board | Yohsuke Ishikawa, Yoshiaki Esaki, Takayoshi Ozeki, Ryu Harada | 2020-08-25 |
| 10568201 | Multilayer printed wiring board and multilayer metal clad laminated board | Hiroaki Takahashi, Tomoyuki Aoki, Kiyotaka Komori, Ryu Harada | 2020-02-18 |
| 6770370 | Adhesive composition for semiconductor device and adhesive sheet for semiconductor device using the same | Naoji Suzuki, Osamu Oka, Akihiro Maeda | 2004-08-03 |
| 6395391 | Adhesive tape for electronic parts | Osamu Oka, Fumiki Komagata | 2002-05-28 |
| 6228452 | Adhesive tape for electronic parts | Osamu Oka, Takeshi Nishigaya, Fumiki Komagata | 2001-05-08 |
| 6132865 | Adhesive tape for electronic parts | Osamu Oka, Fumiki Komagata | 2000-10-17 |
| 5863988 | Liquid adhesive for electronic parts and adhesive tape | Takeshi Hashimoto, Katuji Nakaba | 1999-01-26 |