Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10751976 | Resin-clad metal foil and flexible printed wiring board | Yohsuke Ishikawa, Takayoshi Ozeki, Jun Tochihira, Ryu Harada | 2020-08-25 |
| 10543661 | Metal foil with resin, and metal-clad laminate and circuit board using same | Akihiro Yamauchi, Takayoshi Ozeki, Hiroaki UMEHARA, Hiroharu Inoue, Yoshihiko Nakamura | 2020-01-28 |
| 9232636 | Flexible printed wiring board and laminate for production of flexible printed wiring board | Takayoshi Ozeki, Yohsuke Ishikawa, Hiroyuki Fukusumi | 2016-01-05 |
| 9125307 | Flexible metal-cladded base material, method for producing flexible metal-cladded base material, printed wiring board, multilayer flexible printed wiring board, and flex-rigid printed wiring board | Takayoshi Ozeki, Hiroaki UMEHARA | 2015-09-01 |