Issued Patents All Time
Showing 25 most recent of 31 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12275846 | Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and printed wiring board | Jun YASUMOTO, Rihoko Watanabe, Teppei WASHIO | 2025-04-15 |
| 12173151 | Polyphenylene ether resin composition, prepreg using same, film with resin, metal foil with resin, metal-clad laminate and wiring board | Hiroaki UMEHARA, Fumito Suzuki, Jun YASUMOTO | 2024-12-24 |
| 12122129 | Resin composition, and prepreg, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring board each obtained using said resin composition | Hiroaki UMEHARA, Rihoko Watanabe, Yiqun Wang | 2024-10-22 |
| 12098257 | Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and wiring board | Hirosuke SAITO, Yiqun Wang | 2024-09-24 |
| 11945910 | Resin composition, and prepreg, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring board each obtained using said resin composition | Hiroaki UMEHARA, Rihoko Watanabe, Yiqun Wang | 2024-04-02 |
| 11905409 | Resin composition, and prepreg, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring board each obtained using said resin composition | Kosuke Tsuda, Hirosuke SAITO, Yiqun Wang | 2024-02-20 |
| 11866580 | Polyphenylene ether resin composition, prepreg using same, film with resin, metal foil with resin, metal-clad laminate and wiring board | Hiroaki UMEHARA, Fumito Suzuki, Jun YASUMOTO | 2024-01-09 |
| 11407869 | Prepreg, metal-clad laminate and printed wiring board | Keiko Kashihara, Rihoko Watanabe | 2022-08-09 |
| 11365274 | Resin composition, and prepreg, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring board each obtained using said resin composition | Hiroaki UMEHARA, Yiqun Wang | 2022-06-21 |
| 11234329 | Prepreg, substrate, metal-clad laminate, semiconductor package, and printed circuit board | Rihoko Watanabe, Keiko Kashihara | 2022-01-25 |
| 11066548 | Polyphenylene ether resin composition, prepreg, metal-clad laminate, and printed wiring board | Hiroaki UMEHARA | 2021-07-20 |
| 11059260 | Prepreg, metal-clad laminated board, and printed wiring board | Keiko Kashihara, Takashi Hoshi | 2021-07-13 |
| 10543661 | Metal foil with resin, and metal-clad laminate and circuit board using same | Akihiro Yamauchi, Yoshiaki Esaki, Takayoshi Ozeki, Hiroaki UMEHARA, Yoshihiko Nakamura | 2020-01-28 |
| 10371612 | Prepreg, metal-clad laminated plate, wiring board, and method for measuring thermal stress of wiring board material | Keiko Kashihara, Shingo Yoshioka, Takashi Hoshi | 2019-08-06 |
| 10009997 | Metal-clad laminate and printed wiring board | Koji Kishino | 2018-06-26 |
| 9894761 | Prepreg, metal-clad laminated plate and printed wiring board | Takashi Hoshi, Takeshi Kitamura, Keiko Kashihara | 2018-02-13 |
| 9795030 | Metal-clad laminate and printed wiring board | Koji Kishino | 2017-10-17 |
| 9736935 | Resin composition, resin varnish, prepreg, metal-clad laminated board and printed wiring board | Shingo Yoshioka | 2017-08-15 |
| 9661749 | Metal-clad laminate and printed wiring board | Koji Kishino | 2017-05-23 |
| 9585248 | Resin composition, resin varnish, prepreg, metal-clad laminated board and printed wiring board | Shingo Yoshioka | 2017-02-28 |
| 9578734 | Prepreg, metal-clad laminate, and printed wiring board | Koji Kishino | 2017-02-21 |
| 9516746 | Metal-clad laminate and printed wiring board | Koji Kishino, Takeshi Kitamura | 2016-12-06 |
| 9480148 | Metal-clad laminate and printed wiring board | Shingo Yoshioka, Koji Kishino, Takatoshi Abe | 2016-10-25 |
| 9102850 | Prepreg, metal-clad laminate, and printed wiring board | Koji Kishino, Takashi Hoshi | 2015-08-11 |
| 7838576 | Poly (phenylene ether) resin composition, prepreg, and laminated sheet | Eiichiro Saito, Hiroaki Fujiwara | 2010-11-23 |