HS

Hirosuke SAITO

PA Panasonic: 10 patents #2,582 of 21,108Top 15%
Overall (All Time): #487,929 of 4,157,543Top 15%
10
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
12098257 Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and wiring board Yiqun Wang, Hiroharu Inoue 2024-09-24
11905409 Resin composition, and prepreg, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring board each obtained using said resin composition Kosuke Tsuda, Yiqun Wang, Hiroharu Inoue 2024-02-20
11477883 Metal-clad laminate, metal foil with resin, and wiring board Kosuke Tsuda, Hiroaki Fujiwara 2022-10-18
10870721 Polyphenylene ether resin composition, prepreg, metal-clad laminate and printed wiring board Yuki Kitai, Hiroaki Fujiwara 2020-12-22
10590223 Polyphenylene ether resin composition, prepreg, metal-clad laminate and printed wiring board Yuki Kitai, Hiroaki Fujiwara 2020-03-17
10047213 Method of curing thermosetting resin composition, thermosetting resin composition, and PREPREG, metal-clad laminate, resin sheet, printed-wiring board, and sealing material in which thermosetting resin composition is used Hiroaki Fujiwara, Yuki Kitai 2018-08-14
9708468 Thermosetting resin composition, prepreg, metal clad laminate plate, and printed wiring board Yuki Kitai, Hiroaki Fujiwara 2017-07-18
9637598 Method of curing thermosetting resin composition, thermosetting resin composition, and prepreg, metal-clad laminate, resin sheet, printed-wiring board, and sealing material in which thermosetting resin composition is used Hiroaki Fujiwara, Yuki Kitai 2017-05-02
9567481 Resin composition, resin varnish, prepreg, metal-clad laminate and printed wiring board Hiroaki Fujiwara, Yuki Kitai 2017-02-14
9528026 Resin composition, resin varnish, prepreg, metal-clad laminate, and printed wiring board Takashi Sagara, Hidetaka Kakiuchi, Keiko Kashihara, Yuki Kitai, Daisuke Yokoyama +1 more 2016-12-27