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Mikio Sato, Hiroaki Fujiwara, Masashi Koda, Yasunori HOSHINO |
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Surface-treated copper foil, and copper-clad laminate plate, resin-attached copper foil and circuit board each using same |
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Modified polyphenylene ether, method for preparing same, polyphenylene ether resin composition, resin varnish, prepreg, metal-clad laminate and printed circuit board |
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Thermosetting resin composition, prepreg, metal clad laminate plate, and printed wiring board |
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Prepreg, printed wiring board, multilayer circuit board, and process for manufacturing printed wiring board |
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