Issued Patents All Time
Showing 1–25 of 25 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12428534 | Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminated board, and wiring board | Atsushi Wada, Masashi Koda, Ryusei Kozawa | 2025-09-30 |
| 12312452 | Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and wiring board | Atsushi Wada, Masashi Koda, Ryusei Kozawa | 2025-05-27 |
| 12233621 | Copper-clad laminated plate, resin-clad copper foil, and circuit substrate using said plate and foil | Masashi Koda, Yasunori HOSHINO, Atsushi Wada, Mikio Sato | 2025-02-25 |
| 12109779 | Copper-clad laminate, wiring board, and copper foil with resin | Yuki Inoue, Tatsuya Arisawa | 2024-10-08 |
| 12024590 | Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and wiring board | Mikio Sato, Yasunori HOSHINO, Masashi Koda, Atsushi Wada | 2024-07-02 |
| 12022611 | Prepreg, metal-clad laminate, and wiring board | Yasunori HOSHINO, Atsushi Wada, Masashi Koda, Mikio Sato | 2024-06-25 |
| 11958951 | Resin composition, prepreg, resin-equipped film, resin-equipped metal foil, metal-cladded layered sheet, and wiring board | Masashi Koda, Atsushi Wada, Yasunori HOSHINO | 2024-04-16 |
| 11866536 | Copper-clad laminate plate, resin-attached copper foil, and circuit board using same | Masashi Koda, Yasunori HOSHINO, Atsushi Wada, Mikio Sato | 2024-01-09 |
| 11820105 | Prepreg, metal-clad laminate, and wiring board | Mikio Sato, Hiroaki Fujiwara, Masashi Koda, Yasunori HOSHINO | 2023-11-21 |
| 11770904 | Surface-treated copper foil, and copper-clad laminate plate, resin-attached copper foil and circuit board each using same | Takeshi Okamoto | 2023-09-26 |
| 11401393 | Prepreg, metal-clad laminate, and wiring board | Mikio Sato, Yasunori HOSHINO, Masashi Koda, Takayoshi Ozeki, Hiroaki Fujiwara | 2022-08-02 |
| 11351755 | Metal-clad laminate, printed wiring board and metal foil with resin | Hiroaki Fujiwara, Mikio Sato | 2022-06-07 |
| 11254100 | Metal-clad laminate and metal foil with resin | Akira IRIFUNE, Yuki Inoue, Yuki Tokuda | 2022-02-22 |
| 11242425 | Resin composition, prepreg, resin-added film, resin-added metal foil, metal-clad layered plate, and wiring plate | Mikio Sato, Hiroaki Fujiwara, Masashi Koda, Yasunori HOSHINO, Takayoshi Ozeki | 2022-02-08 |
| 10897818 | Metal-clad laminate, method for producing same, metal foil with resin, and printed wiring board | Hiroaki Fujiwara | 2021-01-19 |
| 10870721 | Polyphenylene ether resin composition, prepreg, metal-clad laminate and printed wiring board | Hiroaki Fujiwara, Hirosuke SAITO | 2020-12-22 |
| 10820413 | Metal-clad laminate, metal member with resin, and wiring board | Yuki Inoue, Tatsuya Arisawa | 2020-10-27 |
| 10590223 | Polyphenylene ether resin composition, prepreg, metal-clad laminate and printed wiring board | Hiroaki Fujiwara, Hirosuke SAITO | 2020-03-17 |
| 10240015 | Modified polyphenylene ether, method for preparing same, polyphenylene ether resin composition, resin varnish, prepreg, metal-clad laminate and printed circuit board | Hiroaki Fujiwara | 2019-03-26 |
| 10047213 | Method of curing thermosetting resin composition, thermosetting resin composition, and PREPREG, metal-clad laminate, resin sheet, printed-wiring board, and sealing material in which thermosetting resin composition is used | Hiroaki Fujiwara, Hirosuke SAITO | 2018-08-14 |
| 9708468 | Thermosetting resin composition, prepreg, metal clad laminate plate, and printed wiring board | Hiroaki Fujiwara, Hirosuke SAITO | 2017-07-18 |
| 9637598 | Method of curing thermosetting resin composition, thermosetting resin composition, and prepreg, metal-clad laminate, resin sheet, printed-wiring board, and sealing material in which thermosetting resin composition is used | Hiroaki Fujiwara, Hirosuke SAITO | 2017-05-02 |
| 9567481 | Resin composition, resin varnish, prepreg, metal-clad laminate and printed wiring board | Hirosuke SAITO, Hiroaki Fujiwara | 2017-02-14 |
| 9528026 | Resin composition, resin varnish, prepreg, metal-clad laminate, and printed wiring board | Takashi Sagara, Hidetaka Kakiuchi, Keiko Kashihara, Hirosuke SAITO, Daisuke Yokoyama +1 more | 2016-12-27 |
| 8409704 | Prepreg, printed wiring board, multilayer circuit board, and process for manufacturing printed wiring board | Yasuo Fukuhara, Tomoaki Watanabe, Mao Yamaguchi, Hiroaki Fujiwara | 2013-04-02 |