Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12109779 | Copper-clad laminate, wiring board, and copper foil with resin | Yuki Inoue, Yuki Kitai | 2024-10-08 |
| 11895770 | Copper-clad laminate, wiring board, and copper foil provided with resin | Yuki Inoue, Shun YAMAGUCHI | 2024-02-06 |
| 11330710 | Metal-clad laminated board, metal member provided with resin, and wiring board | Hirohisa Goto, Tomoyuki Abe | 2022-05-10 |
| 11312858 | Resin composition, prepreg, film including resin, metal foil including resin, metal-clad laminate, and wiring board | Fumito Suzuki, Shunji Araki, Hirohisa Goto, Yuki Inoue | 2022-04-26 |
| 11267225 | Metal-clad laminated board, method for producing metal-clad laminated board, resin-attached metal member, method for producing resin-attached metal member, wiring board and method for producing wiring board | Tomoyuki Abe, Shunji Araki, Yuki Inoue | 2022-03-08 |
| 11078361 | Resin composition, method for producing resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and wiring board | Hirohisa Goto, Tomoyuki Abe | 2021-08-03 |
| 10820413 | Metal-clad laminate, metal member with resin, and wiring board | Yuki Inoue, Yuki Kitai | 2020-10-27 |
| 9775239 | Resin composition for printed wiring board, prepreg, metal-clad laminate, and printed wiring board | Yoshihiko Nakamura, Tomoyuki Abe, Kiyotaka Komori, Syouji Hasimoto, Mitsuyoshi Nishino | 2017-09-26 |