Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12162257 | Metal clad laminated plate and method for manufacturing metal clad laminated plate | Masaya Koyama, Yusuke Ito, Yoshinori Matsuzaki, Hiroaki Takahashi | 2024-12-10 |
| 11818835 | Multilayer printed wiring board, multilayer metal-clad laminated board, and resin-coated metal foil | Hiroaki Takahashi, Masaya Koyama, Jun Tochihira, Ryu Harada | 2023-11-14 |
| 11039533 | Printed wiring board and method for manufacturing printed wiring board | Hiroaki Takahashi, Masaya Koyama, Yutaka Tashiro, Hiroki Morikawa | 2021-06-15 |
| 10668697 | Method for manufacturing metal clad laminated board, method for manufacturing electronic circuit board, and rigid body pendulum type viscoelasticity measuring device | Masaya Koyama, Hiroaki Takahashi, Yoshinori Matsuzaki, Tadashi Mori | 2020-06-02 |
| 10568201 | Multilayer printed wiring board and multilayer metal clad laminated board | Hiroaki Takahashi, Tomoyuki Aoki, Jun Tochihira, Ryu Harada | 2020-02-18 |
| 9775239 | Resin composition for printed wiring board, prepreg, metal-clad laminate, and printed wiring board | Tatsuya Arisawa, Yoshihiko Nakamura, Tomoyuki Abe, Syouji Hasimoto, Mitsuyoshi Nishino | 2017-09-26 |
| 9730320 | Prepreg, laminate, metal foil-clad laminate, circuit board and LED module | Takashi Matsuda, Akiyoshi Nozue, Takayuki Suzue, Mitsuyoshi Nishino, Toshiyuki Asahi +2 more | 2017-08-08 |
| 9718941 | Thermosetting resin composition, prepreg, laminate, metal foil-clad laminate, and circuit board | Takashi Matsuda, Mitsuyoshi Nishino | 2017-08-01 |
| 9307636 | Printed wiring board | Hiroaki Kato | 2016-04-05 |
| 8603624 | Prepreg, laminate, metal clad laminate, circuit board, and circuit board for LED mounting | Takashi Matsuda, Akiyoshi Nozue, Takayuki Suzue, Mitsuyoshi Nishino, Toshiyuki Asahi +2 more | 2013-12-10 |
| 7288587 | Poly(phenylene oxide) resin composition, prepreg, laminates sheet, printed wiring board, and multilayer printed wiring board | Eiitirou Saitou, Naoki Itou | 2007-10-30 |
| 6589656 | Epoxy resin composition, prepreg and metal-clad laminate | Tetsuya Maekawa, Takao Hayashi, Takeshi Yoshimura, Eiichiro Saito | 2003-07-08 |
| 6403690 | Flame retardant resin composition | Keiko Kashihara, Kenji Ogasawara, Akiyoshi Nozue, Shigehiro Okada | 2002-06-11 |
| 5407872 | Glass fiber forming composition, glass fibers obtained from the composition and substrate for circuit board including the glass fibers as reinforcing material | Seishiro Yamakawa, Shigeru Yamamoto, Jun Naka, Tadashi Kokubo | 1995-04-18 |
| 5334645 | Substrate for circuit board including the glass fibers as reinforcing material | Seishiro Yamakawa, Shigeru Yamamoto, Jun Naka, Tadashi Kokubo | 1994-08-02 |
| 5284807 | Glass fiber forming composition, glass fibers obtained from the composition and substrate for circuit board including the glass fibers as reinforcing material | Seishiro Yamakawa, Shigeru Yamamoto, Jun Naka, Tadashi Kukubo | 1994-02-08 |
| 5275878 | Composite dielectric and printed-circuit use substrate utilizing the same | Seishiro Yamakawa, Michimasa Tsuzaki, Satoshi Fujiki, Akiyoshi Nozue, Kazunobu Abe +1 more | 1994-01-04 |