Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12404399 | Thermosetting resin sheet and printed wiring board | — | 2025-09-02 |
| 12006433 | Thermosetting resin composition, resin sheet, laminate, and printed wiring board | Kouichi AOKI, Tomoyuki Aoki | 2024-06-11 |
| 11814502 | Resin composition, resin film, metal foil with resin, prepreg, metal-clad laminate, and printed wiring board | Akihiro Yamauchi, Nobuo Shibata, Kouichi AOKI | 2023-11-14 |
| 11617261 | Resin composition, resin film, metal foil with resin, prepreg, metal-clad laminate, and printed wiring board | Akihiro Yamauchi, Kouichi AOKI | 2023-03-28 |
| 11114354 | Printed wiring board, printed circuit board, prepreg | Akira Ito, Kengo Yamanouti | 2021-09-07 |
| 10791633 | Thick conductor built-in type printed wiring board and method for producing same | Akira Ito, Naohito Fukuya | 2020-09-29 |
| 7838576 | Poly (phenylene ether) resin composition, prepreg, and laminated sheet | Hiroharu Inoue, Hiroaki Fujiwara | 2010-11-23 |
| 7413791 | Poly (phenylene ether) resin composition, prepreg, and laminated sheet | Hiroharu Inoue, Hiroaki Fujiwara | 2008-08-19 |
| 6589656 | Epoxy resin composition, prepreg and metal-clad laminate | Tetsuya Maekawa, Takao Hayashi, Takeshi Yoshimura, Kiyotaka Komori | 2003-07-08 |
| 5312651 | Method for making a prepreg of an epoxy resin impregnated fiberglass substrate | Toshiharu Takada | 1994-05-17 |
| 5136015 | Addition type imide resin prepolymer, manufacturing method thereof, prepreg and laminate thereof | Tatsuo Yonemoto, Masahiro Matsumura, Yoshihisa Sugawa, Hiroshi Yamamoto, Keiko Kashihara | 1992-08-04 |
| 5112989 | Process for producing unsaturated mono and dicarboxylic acid imide compound | Tatsuo Yonemoto, Masahiro Matsumura | 1992-05-12 |