Issued Patents All Time
Showing 1–25 of 55 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12362209 | Information processing apparatus, information processing method, article manufacturing system, and article manufacturing method | — | 2025-07-15 |
| 11820105 | Prepreg, metal-clad laminate, and wiring board | Mikio Sato, Yuki Kitai, Masashi Koda, Yasunori HOSHINO | 2023-11-21 |
| 11603941 | Relief valve | Masahiro Matsuo | 2023-03-14 |
| 11555338 | Vehicle door latch apparatus | Tomoharu Nagaoka | 2023-01-17 |
| 11477883 | Metal-clad laminate, metal foil with resin, and wiring board | Kosuke Tsuda, Hirosuke SAITO | 2022-10-18 |
| 11466706 | Valve device | Noboru Ito, Hiroshi Itoh | 2022-10-11 |
| 11454051 | Vehicle door latch apparatus | Tomoharu Nagaoka | 2022-09-27 |
| 11401393 | Prepreg, metal-clad laminate, and wiring board | Yuki Kitai, Mikio Sato, Yasunori HOSHINO, Masashi Koda, Takayoshi Ozeki | 2022-08-02 |
| 11351755 | Metal-clad laminate, printed wiring board and metal foil with resin | Yuki Kitai, Mikio Sato | 2022-06-07 |
| 11293560 | Solenoid flow control valve | Noboru Ito | 2022-04-05 |
| 11242425 | Resin composition, prepreg, resin-added film, resin-added metal foil, metal-clad layered plate, and wiring plate | Mikio Sato, Yuki Kitai, Masashi Koda, Yasunori HOSHINO, Takayoshi Ozeki | 2022-02-08 |
| 10982692 | Swing-back preventing apparatus | Masahiro Matsuo | 2021-04-20 |
| 10897818 | Metal-clad laminate, method for producing same, metal foil with resin, and printed wiring board | Yuki Kitai | 2021-01-19 |
| 10870721 | Polyphenylene ether resin composition, prepreg, metal-clad laminate and printed wiring board | Yuki Kitai, Hirosuke SAITO | 2020-12-22 |
| 10590223 | Polyphenylene ether resin composition, prepreg, metal-clad laminate and printed wiring board | Yuki Kitai, Hirosuke SAITO | 2020-03-17 |
| 10518589 | Pneumatic tire | Fumitaka Kobayashi | 2019-12-31 |
| 10240015 | Modified polyphenylene ether, method for preparing same, polyphenylene ether resin composition, resin varnish, prepreg, metal-clad laminate and printed circuit board | Yuki Kitai | 2019-03-26 |
| 10047213 | Method of curing thermosetting resin composition, thermosetting resin composition, and PREPREG, metal-clad laminate, resin sheet, printed-wiring board, and sealing material in which thermosetting resin composition is used | Yuki Kitai, Hirosuke SAITO | 2018-08-14 |
| 9795033 | Method of mounting semiconductor chips, semiconductor device obtained using the method, method of connecting semiconductor chips, three-dimensional structure in which wiring is provided on its surface, and method of producing the same | Shingo Yoshioka | 2017-10-17 |
| 9708468 | Thermosetting resin composition, prepreg, metal clad laminate plate, and printed wiring board | Yuki Kitai, Hirosuke SAITO | 2017-07-18 |
| 9637598 | Method of curing thermosetting resin composition, thermosetting resin composition, and prepreg, metal-clad laminate, resin sheet, printed-wiring board, and sealing material in which thermosetting resin composition is used | Yuki Kitai, Hirosuke SAITO | 2017-05-02 |
| 9567481 | Resin composition, resin varnish, prepreg, metal-clad laminate and printed wiring board | Hirosuke SAITO, Yuki Kitai | 2017-02-14 |
| 9528026 | Resin composition, resin varnish, prepreg, metal-clad laminate, and printed wiring board | Takashi Sagara, Hidetaka Kakiuchi, Keiko Kashihara, Yuki Kitai, Hirosuke SAITO +1 more | 2016-12-27 |
| 9351402 | Circuit board, and semiconductor device having component mounted on circuit board | Shingo Yoshioka, Hiromitsu Takashita, Tsuyoshi Takeda | 2016-05-24 |
| 9332650 | Method of producing multilayer circuit board | Shingo Yoshioka | 2016-05-03 |