Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12233621 | Copper-clad laminated plate, resin-clad copper foil, and circuit substrate using said plate and foil | Yuki Kitai, Masashi Koda, Atsushi Wada, Mikio Sato | 2025-02-25 |
| 12024590 | Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and wiring board | Mikio Sato, Yuki Kitai, Masashi Koda, Atsushi Wada | 2024-07-02 |
| 12021015 | Thermosetting resin composition, metal-clad laminated plate, insulating sheet, printed wiring board, method of manufacturing printed wiring board, and package substrate | Hiroki Tamiya, Koji Kishino, Ryuji Takahashi, Takahiro Yamada, Shimpei Obata +3 more | 2024-06-25 |
| 12022611 | Prepreg, metal-clad laminate, and wiring board | Yuki Kitai, Atsushi Wada, Masashi Koda, Mikio Sato | 2024-06-25 |
| 11958951 | Resin composition, prepreg, resin-equipped film, resin-equipped metal foil, metal-cladded layered sheet, and wiring board | Masashi Koda, Yuki Kitai, Atsushi Wada | 2024-04-16 |
| 11866536 | Copper-clad laminate plate, resin-attached copper foil, and circuit board using same | Yuki Kitai, Masashi Koda, Atsushi Wada, Mikio Sato | 2024-01-09 |
| 11820105 | Prepreg, metal-clad laminate, and wiring board | Mikio Sato, Hiroaki Fujiwara, Yuki Kitai, Masashi Koda | 2023-11-21 |
| 11647583 | Prepreg, metal-clad laminated board, and printed wiring board | Shimpei Obata, Ryuuji Takahashi, Shigetoshi Fujita | 2023-05-09 |
| 11401393 | Prepreg, metal-clad laminate, and wiring board | Yuki Kitai, Mikio Sato, Masashi Koda, Takayoshi Ozeki, Hiroaki Fujiwara | 2022-08-02 |
| 11242425 | Resin composition, prepreg, resin-added film, resin-added metal foil, metal-clad layered plate, and wiring plate | Mikio Sato, Hiroaki Fujiwara, Yuki Kitai, Masashi Koda, Takayoshi Ozeki | 2022-02-08 |
| 10472478 | Prepreg, metal-clad laminate and printed wiring board | Shimpei Obata, Shigetoshi Fujita, Ryuji Takahashi | 2019-11-12 |