Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12021015 | Thermosetting resin composition, metal-clad laminated plate, insulating sheet, printed wiring board, method of manufacturing printed wiring board, and package substrate | Koji Kishino, Ryuji Takahashi, Yasunori HOSHINO, Takahiro Yamada, Shimpei Obata +3 more | 2024-06-25 |
| 11638349 | Metal-clad laminate and printed wiring board | Dai Sasaki, Yasunori NISHIGUCHI, Kazuki Matsumura, Yohsuke Ishikawa, Koji Kishino | 2023-04-25 |
| 8846799 | Epoxy resin composition, prepreg, and metal-clad laminate and multilayered printed wiring board | Hiroyuki Fujisawa | 2014-09-30 |
| 8344262 | Epoxy resin composition for printed wiring board, resin composition varnish, prepreg, metal clad laminate, printed wiring board and multilayer printed wiring board | Yoshihiko Nakamura, Shunji Araki, Eiji Imaizumi, Kentarou Fujino, Tomoaki Sawada +1 more | 2013-01-01 |