Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8344262 | Epoxy resin composition for printed wiring board, resin composition varnish, prepreg, metal clad laminate, printed wiring board and multilayer printed wiring board | Hiroki Tamiya, Yoshihiko Nakamura, Shunji Araki, Eiji Imaizumi, Tomoaki Sawada +1 more | 2013-01-01 |