Issued Patents All Time
Showing 25 most recent of 42 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10966317 | Sheet-shaped stretchable structure, and resin composition for stretchable resin sheet and stretchable resin sheet used for the structure | Takatoshi Abe, Tomoaki Sawada | 2021-03-30 |
| 10791624 | Resin composition and film using same | Tomoaki Sawada, Takatoshi Abe | 2020-09-29 |
| 10371612 | Prepreg, metal-clad laminated plate, wiring board, and method for measuring thermal stress of wiring board material | Keiko Kashihara, Hiroharu Inoue, Takashi Hoshi | 2019-08-06 |
| 10299379 | Sheet-shaped stretchable structure, and resin composition for stretchable resin sheet and stretchable resin sheet used for the structure | Takatoshi Abe, Tomoaki Sawada | 2019-05-21 |
| 10109390 | Conductive film, and touch panel, display, touch sensor, and solar cell using the same | Tomoaki Sawada, Takatoshi Abe | 2018-10-23 |
| 10009994 | Resin composition and film using same | Tomoaki Sawada, Takatoshi Abe | 2018-06-26 |
| 9839119 | Electrically conductive film | Tomoaki Sawada, Takatoshi Abe | 2017-12-05 |
| 9802397 | Structural member for electronic devices | Takatoshi Abe, Tomoaki Sawada | 2017-10-31 |
| 9795033 | Method of mounting semiconductor chips, semiconductor device obtained using the method, method of connecting semiconductor chips, three-dimensional structure in which wiring is provided on its surface, and method of producing the same | Hiroaki Fujiwara | 2017-10-17 |
| 9736935 | Resin composition, resin varnish, prepreg, metal-clad laminated board and printed wiring board | Hiroharu Inoue | 2017-08-15 |
| 9669567 | Manufacturing method of molded article | Tsuyoshi Takeda, Hiromitsu Takashita, Keiko Kashihara | 2017-06-06 |
| 9585248 | Resin composition, resin varnish, prepreg, metal-clad laminated board and printed wiring board | Hiroharu Inoue | 2017-02-28 |
| 9568673 | Dry film for optical waveguides, optical waveguide using same, photoelectric composite wiring board using same, and method for producing photoelectric composite wiring board | Junko Kurizoe, Naoyuki Kondo, Toru Nakashiba, Shinji Hashimoto | 2017-02-14 |
| 9480148 | Metal-clad laminate and printed wiring board | Hiroharu Inoue, Koji Kishino, Takatoshi Abe | 2016-10-25 |
| 9468092 | Electrically conductive film | Tomoaki Sawada, Takatoshi Abe | 2016-10-11 |
| 9351402 | Circuit board, and semiconductor device having component mounted on circuit board | Hiroaki Fujiwara, Hiromitsu Takashita, Tsuyoshi Takeda | 2016-05-24 |
| 9332642 | Circuit board | Hiroaki Fujiwara, Hiromitsu Takashita, Tsuyoshi Takeda | 2016-05-03 |
| 9332650 | Method of producing multilayer circuit board | Hiroaki Fujiwara | 2016-05-03 |
| 9204530 | Electronic components assembly | Hiromitsu Takashita, Tsuyoshi Takeda, Yuko Konno, Hiroaki Fujiwara | 2015-12-01 |
| 9175151 | Resin composition and method for producing circuit board | Yuko Konno, Hiromitsu Takashita, Tsuyoshi Takeda, Hiroaki Fujiwara | 2015-11-03 |
| 9082825 | Manufacturing method for semiconductor package, semiconductor package, and semiconductor device | Hiromitsu Takashita, Tsuyoshi Takeda, Keiko Kashihara, Hiroaki Fujiwara | 2015-07-14 |
| 9082438 | Three-dimensional structure for wiring formation | Hiroaki Fujiwara, Hiromitsu Takashita, Tsuyoshi Takeda | 2015-07-14 |
| 9082635 | Wiring method, structure having wiring provided on surface, semiconductor device, wiring board, memory card, electric device, module and multilayer circuit board | Hiroaki Fujiwara, Hiromitsu Takashita, Tsuyoshi Takeda, Yuko Konno | 2015-07-14 |
| 9070393 | Three-dimensional structure in which wiring is provided on its surface | Hiroaki Fujiwara, Hiromitsu Takashita, Tsuyoshi Takeda | 2015-06-30 |
| 8929092 | Circuit board, and semiconductor device having component mounted on circuit board | Hiroaki Fujiwara, Hiromitsu Takashita, Tsuyoshi Takeda | 2015-01-06 |