Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12173151 | Polyphenylene ether resin composition, prepreg using same, film with resin, metal foil with resin, metal-clad laminate and wiring board | Fumito Suzuki, Jun YASUMOTO, Hiroharu Inoue | 2024-12-24 |
| 12122129 | Resin composition, and prepreg, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring board each obtained using said resin composition | Rihoko Watanabe, Hiroharu Inoue, Yiqun Wang | 2024-10-22 |
| 11945910 | Resin composition, and prepreg, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring board each obtained using said resin composition | Rihoko Watanabe, Hiroharu Inoue, Yiqun Wang | 2024-04-02 |
| 11866580 | Polyphenylene ether resin composition, prepreg using same, film with resin, metal foil with resin, metal-clad laminate and wiring board | Fumito Suzuki, Jun YASUMOTO, Hiroharu Inoue | 2024-01-09 |
| 11365274 | Resin composition, and prepreg, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring board each obtained using said resin composition | Yiqun Wang, Hiroharu Inoue | 2022-06-21 |
| 11066548 | Polyphenylene ether resin composition, prepreg, metal-clad laminate, and printed wiring board | Hiroharu Inoue | 2021-07-20 |
| 10543661 | Metal foil with resin, and metal-clad laminate and circuit board using same | Akihiro Yamauchi, Yoshiaki Esaki, Takayoshi Ozeki, Hiroharu Inoue, Yoshihiko Nakamura | 2020-01-28 |
| 9125307 | Flexible metal-cladded base material, method for producing flexible metal-cladded base material, printed wiring board, multilayer flexible printed wiring board, and flex-rigid printed wiring board | Takayoshi Ozeki, Yoshiaki Esaki | 2015-09-01 |