Issued Patents All Time
Showing 26–50 of 82 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5969414 | Semiconductor package with molded plastic body | Arvind Parthasarathi | 1999-10-19 |
| 5952719 | Metal ball grid electronic package having improved solder joint | Peter W. Robinson, Paul R. Hoffman | 1999-09-14 |
| 5939214 | Thermal performance package for integrated circuit chip | Jacob Crane, Abid Khan | 1999-08-17 |
| 5814759 | Lead-free shot | Brian Mravic, Gerald N. Violette, Eugene Shapiro, Henry J. Halverson | 1998-09-29 |
| 5741544 | Articles using specialized vapor deposition processes | — | 1998-04-21 |
| 5688606 | Anodized aluminum substrate having increased breakdown voltage | Efraim Sagiv, Arvind Parthasarathi, Satish Jalota, Andrew J. Brock, Michael A. Holmes +3 more | 1997-11-18 |
| 5650592 | Graphite composites for electronic packaging | Harvey P. Cheskis | 1997-07-22 |
| 5629835 | Metal ball grid array package with improved thermal conductivity | Paul R. Hoffman, Jeffrey S. Braden | 1997-05-13 |
| 5608267 | Molded plastic semiconductor package including heat spreader | Derek E. Tyler, Jeffrey S. Braden, James M. Popplewell | 1997-03-04 |
| 5578869 | Components for housing an integrated circuit device | Paul R. Hoffman, George A. Brathwaite, Dawit Solomon, Arvind Parthasarathi | 1996-11-26 |
| 5563442 | Leadframe having exposed, solderable outer lead ends | Arvind Parthasarathi | 1996-10-08 |
| 5559306 | Electronic package with improved electrical performance | — | 1996-09-24 |
| 5545850 | Guard ring for integrated circuit package | Paul R. Hoffman | 1996-08-13 |
| 5540378 | Method for the assembly of an electronic package | Arvind Parthasarathi | 1996-07-30 |
| 5534356 | Anodized aluminum substrate having increased breakdown voltage | Efraim Sagiv, Arvind Parthasarathi, Satish Jalota, Andrew J. Brock, Michael A. Holmes +3 more | 1996-07-09 |
| 5506446 | Electronic package having improved wire bonding capability | Paul R. Hoffman, George A. Brathwaite, Doanh D. Bui | 1996-04-09 |
| 5504372 | Adhesively sealed metal electronic package incorporating a multi-chip module | Jeffrey S. Braden, Jacob Crane | 1996-04-02 |
| 5477008 | Polymer plug for electronic packages | Anthony M. Pasqualoni, Francis S. Jewell, Paul R. Hoffman, George A. Brathwaite, Richard Paul McNabb +1 more | 1995-12-19 |
| 5449951 | Lead frames with improved adhesion to a polymer | Arvind Parthasarathi | 1995-09-12 |
| 5403975 | Anodized aluminum electronic package components | Anthony M. Pasqualoni, Satish Jalota, Andrew J. Brock | 1995-04-04 |
| 5399187 | Lead-free bullett | Brian Mravic, Gerald N. Violette, Eugene Shapiro, Henry J. Halverson | 1995-03-21 |
| 5399805 | Metal electronic package with reduced seal width | Derek E. Tyler, Anthony M. Pasqualoni, Jeffrey S. Braden, Paul R. Hoffman | 1995-03-21 |
| 5367196 | Molded plastic semiconductor package including an aluminum alloy heat spreader | Jeffrey S. Braden, Szuchain Chen | 1994-11-22 |
| 5343073 | Lead frames having a chromium and zinc alloy coating | Arvind Parthasarathi | 1994-08-30 |
| 5324888 | Metal electronic package with reduced seal width | Derek E. Tyler, Anthony M. Pasqualoni, Jeffrey S. Braden, Paul R. Hoffman | 1994-06-28 |