Issued Patents All Time
Showing 51–75 of 82 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5320689 | Surface modified copper alloys | Brian Mravic | 1994-06-14 |
| 5315155 | Electronic package with stress relief channel | Brian E. O'Donnelly, Brian Mravic, Jacob Crane | 1994-05-24 |
| 5213638 | Surface modified copper alloys | Brian Mravic | 1993-05-25 |
| 5155299 | Aluminum alloy semiconductor packages | James M. Popplewell | 1992-10-13 |
| 5122858 | Lead frame having polymer coated surface portions | Julius C. Fister, Gerald N. Violette | 1992-06-16 |
| 5103292 | Metal pin grid array package | — | 1992-04-07 |
| 5098864 | Process for manufacturing a metal pin grid array package | — | 1992-03-24 |
| 5096508 | Surface modified copper alloys | John F. Breedis, George J. Muench | 1992-03-17 |
| 5066368 | Process for producing black integrally colored anodized aluminum components | Anthony M. Pasqualoni, Satish Jalota, Andrew J. Brock | 1991-11-19 |
| 5043534 | Metal electronic package having improved resistance to electromagnetic interference | Jeffrey S. Braden, Stephen P. Noe | 1991-08-27 |
| 5024883 | Electronic packaging of components incorporating a ceramic-glass-metal composite | Narendra N. SinghDeo, Sheldon H. Butt | 1991-06-18 |
| 5023398 | Aluminum alloy semiconductor packages | James M. Popplewell | 1991-06-11 |
| 5020439 | Projectile having improved baseplug | Joseph Winter, Frank N. Mandigo | 1991-06-04 |
| 5015803 | Thermal performance package for integrated circuit chip | Jacob Crane, Abid Khan | 1991-05-14 |
| 5013871 | Kit for the assembly of a metal electronic package | Jacob Crane, Jeffrey S. Braden | 1991-05-07 |
| 4978052 | Semiconductor die attach system | Julius C. Fister, Satyam Choudary Cherukuri, Brian E. O'Donnelly | 1990-12-18 |
| 4961106 | Metal packages having improved thermal dissipation | Sheldon H. Butt | 1990-10-02 |
| 4939316 | Aluminum alloy semiconductor packages | James M. Popplewell | 1990-07-03 |
| 4929516 | Semiconductor die attach system | Michael J. Pryor, Julius C. Fister, Narendra N. SinghDeo, Satyam Choudary Cherukuri | 1990-05-29 |
| 4897508 | Metal electronic package | Sheldon H. Butt, Jacob Crane, Anthony M. Pasqualoni, Edward F. Smith, III | 1990-01-30 |
| 4888449 | Semiconductor package | Jacob Crane, Barry C. Johnson, Sheldon H. Butt | 1989-12-19 |
| 4883778 | Products formed of a ceramic-glass-metal composite | Narendra N. SinghDeo, Sheldon H. Butt | 1989-11-28 |
| 4882212 | Electronic packaging of components incorporating a ceramic-glass-metal composite | Narendra N. SinghDeo, Sheldon H. Butt | 1989-11-21 |
| 4872047 | Semiconductor die attach system | Julius C. Fister, Satyam Choudary Cherukuri, Brian E. O'Donnelly | 1989-10-03 |
| 4821151 | Hermetically sealed package | Michael J. Pryor, Narendra N. SinghDeo | 1989-04-11 |