Issued Patents All Time
Showing 1–25 of 68 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12199006 | Bonded body, power module substrate, power module, method for manufacturing bonded body, and method for manufacturing power module substrate | Nobuyuki Terasaki | 2025-01-14 |
| 11908768 | Method of manufacturing bonded body for insulation circuit substrate board and bonded body for insulation circuit substrate board | Ryohei Yumoto, Tomoya Oohiraki, Takeshi Kitahara | 2024-02-20 |
| 11735434 | Method for producing insulating circuit substrate with heat sink | Ryouhei Yumoto, Tomoya Oohiraki, Takeshi Kitahara | 2023-08-22 |
| 11676882 | Method of manufacturing power module substrate board and ceramic-copper bonded body | Takeshi Kitahara, Tomoya Oohiraki | 2023-06-13 |
| 11478868 | Method for producing bonded body, method for producing insulated circuit board, and method for producing insulated circuit board with heatsink | Ryouhei Yumoto, Soutarou Ooi | 2022-10-25 |
| 11404622 | Insulated heat transfer substrate, thermoelectric conversion module, and method for manufacturing insulated heat transfer substrate | Koya Arai, Shuji Nishimoto, Masahito Komasaki, Yoshirou Kuromitsu | 2022-08-02 |
| 11393738 | Bonded body, power module substrate, power module, method for manufacturing bonded body, and method for manufacturing power module substrate | Nobuyuki Terasaki | 2022-07-19 |
| 11355408 | Method of manufacturing insulating circuit board with heatsink | Takeshi Kitahara | 2022-06-07 |
| 11322424 | Insulation circuit board with heat sink | Ryohei Yumoto, Tomoya Oohiraki, Takeshi Kitahara | 2022-05-03 |
| 11289400 | Method of manufacturing bonded body for insulation circuit substrate board and bonded body for insulation circuit substrate board | Ryohei Yumoto, Tomoya Oohiraki, Takeshi Kitahara | 2022-03-29 |
| 11289390 | Insulation circuit board with heat sink | Ryohei Yumoto, Tomoya Oohiraki, Takeshi Kitahara | 2022-03-29 |
| 11062974 | Bonded body, power module substrate, method for manufacturing bonded body, and method for manufacturing power module substrate | Nobuyuki Terasaki | 2021-07-13 |
| 11013107 | Insulated circuit board | Takeshi Kitahara, Ryohei Yumoto | 2021-05-18 |
| 10734297 | Ag underlayer-attached metallic member, Ag underlayer-attached insulating circuit substrate,semiconductor device, heat sink-attached insulating circuit substrate, and method for manufacturing Ag underlayer-attached metallic member | Shuji Nishimoto | 2020-08-04 |
| 10607907 | Ceramic-aluminum conjugate, power module substrate, and power module | Yoshirou Kuromitsu, Kazuhiro Akiyama, Toshiyuki Nagase, Nobuyuki Terasaki, Yuichi Ikuhara +2 more | 2020-03-31 |
| 10600719 | Bonded body, power module substrate with heat sink, heat sink, method of manufacturing bonded body, method of manufacturing power module substrate with heat sink, and method of manufacturing heat sink | Nobuyuki Terasaki | 2020-03-24 |
| 10573798 | Thermoelectric conversion module and thermoelectric conversion device | Yoshinobu Nakada, Toshiyuki Nagase, Masahito Komasaki | 2020-02-25 |
| 10526252 | Ceramic/aluminum joined body, insulating circuit board, power module, LED module, and thermoelectric module | Nobuyuki Terasaki | 2020-01-07 |
| 10504749 | Semiconductor device | Shuji Nishimoto | 2019-12-10 |
| 10497637 | Bonded body, substrate for power module with heat sink, heat sink, method for producing bonded body, method for producing substrate for power module with heat sink, and method for producing heat sink | Nobuyuki Terasaki | 2019-12-03 |
| 10497585 | Bonded body, substrate for power module with heat sink, heat sink, method for producing bonded body, method for producing substrate for power module with heat sink, and method for producing heat sink | Nobuyuki Terasaki | 2019-12-03 |
| 10453783 | Power module substrate | Toyo Ohashi | 2019-10-22 |
| 10410951 | Bonded body, substrate for power module with heat sink, heat sink, method for producing bonded body, method for producing substrate for power module with heat sink, and method for producing heat sink | Nobuyuki Terasaki | 2019-09-10 |
| 10370303 | Process for producing bonded body and process for producing power module substrate | Nobuyuki Terasaki | 2019-08-06 |
| 10375825 | Power module substrate, power module substrate with heat sink, power module, method of manufacturing power module substrate, and copper member-bonding paste | Nobuyuki Terasaki, Kimihito Nishikawa, Yoshirou Kuromitsu | 2019-08-06 |