TN

Toshiyuki Nagase

MM Mitsubishi Materials: 22 patents #16 of 1,543Top 2%
MM Mitsubishi Metal: 2 patents #18 of 150Top 15%
TO Toyota: 2 patents #10,861 of 26,838Top 45%
NE Nec Electronics: 1 patents #715 of 1,789Top 40%
RE Renesas Electronics: 1 patents #2,739 of 4,529Top 65%
TT The University Of Tokyo: 1 patents #1,000 of 2,633Top 40%
Overall (All Time): #137,259 of 4,157,543Top 4%
28
Patents All Time

Issued Patents All Time

Showing 1–25 of 28 patents

Patent #TitleCo-InventorsDate
11724744 Vehicle 2023-08-15
11505079 Hybrid vehicle and method for controlling hybrid vehicle Tamaki OZAWA, Masaaki Kiyohara, Hajime Kushima, Yuki Shimizu, Akio UOTANI 2022-11-22
10607907 Ceramic-aluminum conjugate, power module substrate, and power module Yoshirou Kuromitsu, Kazuhiro Akiyama, Yoshiyuki Nagatomo, Nobuyuki Terasaki, Yuichi Ikuhara +2 more 2020-03-31
10573798 Thermoelectric conversion module and thermoelectric conversion device Yoshinobu Nakada, Masahito Komasaki, Yoshiyuki Nagatomo 2020-02-25
10121574 Resistor and method for manufacturing resistor Masahito Komasaki 2018-11-06
10037837 Resistor and method for manufacturing resistor Hiroya Ishizuka 2018-07-31
9862045 Power-module substrate and manufacturing method thereof Takeshi Kitahara, Ryo Muranaka 2018-01-09
9764416 Power module substrate, heat-sink-attached power module substrate, and heat-sink-attached power module Yoshiyuki Nagatomo, Nobuyuki Terasaki 2017-09-19
9715263 BMC processing circuit, USB power delivery controller, BMC reception method, and non-transitory computer readable medium storing BMC reception program 2017-07-25
9642275 Power module Touyou Ohashi, Yoshiyuki Nagatomo, Yoshirou Kuromitsu 2017-05-02
9426915 Power module Touyou Ohashi, Yoshiyuki Nagatomo, Yoshirou Kuromitsu 2016-08-23
9401340 Semiconductor device and ceramic circuit substrate, and producing method of semiconductor device Shuji Nishimoto, Yoshiyuki Nagatomo 2016-07-26
9237682 Power module substrate with heat sink, and method for producing power module substrate with heat sink Yoshiyuki Nagatomo, Hiroya Ishizuka, Yoshirou Kuromitsu, Masakazu Edo, Hideyuki Miyake 2016-01-12
8188376 Insulation substrate, power module substrate, manufacturing method thereof, and power module using the same Takeshi Negishi 2012-05-29
8164909 Al/AlN joint material, base plate for power module, power module, and manufacturing method of Al/AlN joint material Yoshiyuki Nagatomo, Kazuaki Kubo, Takeshi Negishi 2012-04-24
8116084 Method for manufacturing power module substrate, power module substrate, and power module Takeshi Kitahara, Yoshiyuki Nagatomo, Yoshirou Kuromitsu 2012-02-14
8001682 Insulation substrate, power module substrate, manufacturing method thereof, and power module using the same Takeshi Negishi 2011-08-23
7565467 USB hub, USB-compliant apparatus, and communication system 2009-07-21
7532481 Al/AlN joint material, base plate for power module, power module, and manufacturing method of Al/AlN joint material Yoshiyuki Nagatomo, Kazuaki Kubo, Takeshi Negishi 2009-05-12
7128979 Circuit board, method of producing same, and power module Yoshiyuki Nagatomo 2006-10-31
7019975 Power module and power module with heat sink Yoshiyuki Nagatomo, Shoichi Shimamura 2006-03-28
6563709 Liquid-cooled heat sink and manufacturing method thereof Takeshi Negishi, Yoshiyuki Nagatomo, Shoichi Shimamura, Asao Tokiwa 2003-05-13
6483185 Power module substrate, method of producing the same, and semiconductor device including the substrate Yoshiyuki Nagatomo, Kazuaki Kubo, Shoichi Shimamura, Koichi Goshi 2002-11-19
6310775 Power module substrate Yoshiyuki Nagatomo, Kazuaki Kubo, Shoichi Shimamura 2001-10-30
6033787 Ceramic circuit board with heat sink Yoshirou Kuromitsu, Kunio Sugamura, Yoshio Kanda, Masafumi Hatsushika, Masato Otsuki 2000-03-07