Issued Patents All Time
Showing 1–25 of 58 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12356554 | Method for manufacturing bonded body and method for manufacturing insulation circuit substrate | Ryohei Yumoto | 2025-07-08 |
| 11908768 | Method of manufacturing bonded body for insulation circuit substrate board and bonded body for insulation circuit substrate board | Ryohei Yumoto, Tomoya Oohiraki, Yoshiyuki Nagatomo | 2024-02-20 |
| 11871275 | Node apparatus, method for controlling the same, and storage medium | Nobutaka Matsumoto, Koutarou Ichikawa, Akinari Nanba | 2024-01-09 |
| 11735434 | Method for producing insulating circuit substrate with heat sink | Ryouhei Yumoto, Tomoya Oohiraki, Yoshiyuki Nagatomo | 2023-08-22 |
| 11676882 | Method of manufacturing power module substrate board and ceramic-copper bonded body | Tomoya Oohiraki, Yoshiyuki Nagatomo | 2023-06-13 |
| 11546921 | Wireless communication apparatus and server apparatus | Hidenori Akita, Ryo Tamura, Keisuke Kunitomo, Takuya Miyasaka, Osamu Kobayashi +1 more | 2023-01-03 |
| 11355408 | Method of manufacturing insulating circuit board with heatsink | Yoshiyuki Nagatomo | 2022-06-07 |
| 11330497 | Communication control apparatus, control method thereof, and storage medium | Tomonobu Niwa, Koutarou Ichikawa | 2022-05-10 |
| 11322424 | Insulation circuit board with heat sink | Ryohei Yumoto, Tomoya Oohiraki, Yoshiyuki Nagatomo | 2022-05-03 |
| 11304050 | Node apparatus in a network, control method thereof, and storage medium for control of paging policy | Nobutaka Matsumoto | 2022-04-12 |
| 11289390 | Insulation circuit board with heat sink | Ryohei Yumoto, Tomoya Oohiraki, Yoshiyuki Nagatomo | 2022-03-29 |
| 11289400 | Method of manufacturing bonded body for insulation circuit substrate board and bonded body for insulation circuit substrate board | Ryohei Yumoto, Tomoya Oohiraki, Yoshiyuki Nagatomo | 2022-03-29 |
| 11043128 | Merging support information distribution apparatus, merging support system, merging support information distribution method, and computer program | Kengo Kurosawa, Koutarou Ichikawa, Satoshi Komorita, Masayuki Itoh, Daisaku Honda +1 more | 2021-06-22 |
| 11013107 | Insulated circuit board | Ryohei Yumoto, Yoshiyuki Nagatomo | 2021-05-18 |
| 10211068 | Power-module substrate with cooler and method of producing the same | Sotaro Oi, Tomoya Oohiraki | 2019-02-19 |
| 9862045 | Power-module substrate and manufacturing method thereof | Toshiyuki Nagase, Ryo Muranaka | 2018-01-09 |
| 9101063 | Power module substrate, power module, and method for manufacturing power module substrate | Yoshirou Kuromitsu, Kazuhiro Akiyama, Hiroshi Tonomura | 2015-08-04 |
| 9095062 | Power module substrate, power module, and method for manufacturing power module substrate | Yoshirou Kuromitsu, Kazuhiro Akiyama, Hiroshi Tonomura | 2015-07-28 |
| 9079264 | Ceramic substrate, method of manufacturing ceramic substrate, and method of manufacturing power module substrate | Hiroshi Tonomura, Hiroya Ishizuka, Yoshirou Kuromitsu, Yoshiyuki Nagatomo | 2015-07-14 |
| 8921996 | Power module substrate, power module, and method for manufacturing power module substrate | Yoshirou Kuromitsu, Yoshiyuki Nagatomo, Hiroshi Tonomura, Kazuhiro Akiyama | 2014-12-30 |
| 8637777 | Power module substrate having heatsink, method for manufacturing the same, power module having heatsink, and power module substrate | Hiromasa Hayashi, Hiroshi Tonomura, Hiroya Ishizuka, Yoshirou Kuromitsu | 2014-01-28 |
| 8609993 | Power module substrate, power module, and method for manufacturing power module substrate | Yoshirou Kuromitsu, Kazuhiro Akiyama, Hiroshi Tonomura | 2013-12-17 |
| 8564118 | Power module substrate, power module, and method for manufacturing power module substrate | Yoshirou Kuromitsu, Yoshiyuki Nagatomo, Hiroshi Tonomura, Kazuhiro Akiyama | 2013-10-22 |
| 8446827 | Radio communication terminal | Hajime Nakamura, Yasuhiko Hiehata | 2013-05-21 |
| 8311052 | Control of packet buffer using token buckets with different token bucket sizes | Hajime Nakamura, Norihiro Fukumoto | 2012-11-13 |